Design and Optimization Techniques of Over-Chip Bond-Wire Microtransformers With LTCC Core-Reference-Cited by-同舟云学术

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Design and Optimization Techniques of Over-Chip Bond-Wire Microtransformers With LTCC Core

Published:2018-06 Issue:2 Volume:6 Page:592-603
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Camarda Antonio^ORCID,Macrelli Enrico,Paganelli Rudi Paolo,Tartagni Marco,Roy Saibal,Romani Aldo^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/8353171/08036179.pdf?arnumber=8036179

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of High Voltage EMC filters for Electric Vehicles charging applications;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04

2. Characterization of Microtransformers with Magnetic Ni-Fe-W alloy Cores Plated at Two Different Substrate Temperatures;Sensors and Actuators A: Physical;2022-05

3. A Novel Passive Interface Circuit With Gain for Nongenerating Sensors in Differential or Bridge Configuration;IEEE Transactions on Instrumentation and Measurement;2021

4. A 4 mm toroidal microtransformer built with wire bonding and MCM technologies;2019 34th Symposium on Microelectronics Technology and Devices (SBMicro);2019-08

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