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Exploiting Distinct Thermal Response Properties for Power Semiconductor Module Health Monitoring

  • Published:2021-08 Issue:4 Volume:9 Page:4865-4878
  • ISSN:2168-6777
  • Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
  • language:
  • Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Polom Timothy A.ORCID,van der Broeck Christoph H.ORCID,De Doncker Rik W.,Lorenz Robert D.

Funder

Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC), University of Wisconsin–Madison

German Academic Exchange Service

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Degradation Diagnosis During Active Power Cycling via Frequency-Domain Thermal Impedance Spectroscopy;2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia);2023-05-22

2. An Adaptive Temperature Observer for Electrothermal Analysis of IGBT Based on Temperature Characteristics;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-04

3. Degradation Diagnosis of Power Modules based on Thermal Phase Response Sensing and Artificial Neural Networks;IEEE Transactions on Industry Applications;2023

4. Diagnosing Degradation in Power Modules Using Phase Delay Changes of Electrical Response;2022 IEEE 7th Southern Power Electronics Conference (SPEC);2022-12-05

5. An Online Identification Method of Thermal Dissipation State for Forced Air-Cooled System of Power Converters;IEEE Journal of Emerging and Selected Topics in Power Electronics;2022-12
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