3-D-Lumped Thermal Network Models for the Reliability Analysis of Fan-Cooled Plate-Fin Heatsink-Reference-Cited by-同舟云学术

3-D-Lumped Thermal Network Models for the Reliability Analysis of Fan-Cooled Plate-Fin Heatsink

Published:2023-06 Issue:3 Volume:11 Page:3480-3491
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Fu Heping¹^ORCID,Chen Jie¹^ORCID,Wang Hui²,Liu Zhigang³^ORCID,Sørensen Henrik⁴^ORCID,Bahman Amir Sajjad⁴^ORCID

Affiliation:

1. School of Electrical Engineering, Beijing Jiaotong University, Beijing, China

2. Beijing Institute of Aerospace Launch Technology, Beijing, China

3. Beijing Engineering Research Center for Electrical Rail Transit, Beijing, China

4. Department of Energy Technology, Aalborg University, Aalborg, Denmark

Funder

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

Reference28 articles.

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