Research on Signal Integrity in High-Speed Interconnection Channel Based on SIwave
Author:
Affiliation:
1. China Academy of Space Technology,Beijing Institute of Control Engineering,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9697107/9697111/09697238.pdf?arnumber=9697238
Reference6 articles.
1. Power integrity concepts for high-speed design on multi-layer PCBs
2. Power Integrity Analysis for High-Speed PCB
3. Power integrity analysis for solid state drive PCB
4. Power Integrity Analysis of FPGA Heterogeneous Accelerate Board;zheng;Journal of Beijing University of Posts and Telecommunications,2018
5. Power integrity analysis for high performance design
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1. Design and Reliability Analysis of Spaceborne Microsystem SiP;2023 6th International Conference on Electronics and Electrical Engineering Technology (EEET);2023-12-01
2. Design and Analysis of Microsystem SiP for on-Board Embedded Computer;2023 5th International Conference on Circuits and Systems (ICCS);2023-10-27
3. Certain Investigation on Impedance control of High Speed signals in Printed Circuit Board;2022 International Conference on Inventive Computation Technologies (ICICT);2022-07-20
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