Evaluation of High-Speed Signal Transmission Characteristics of Self-Assembling Anisotropic Conductive Adhesives (SACA)-Reference-Cited by-同舟云学术

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Evaluation of High-Speed Signal Transmission Characteristics of Self-Assembling Anisotropic Conductive Adhesives (SACA)

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Song Eakhwan¹,Sim Changhoon²,Lee Kyungsub²,Ha Tai Woong³,Lee Sanguk⁴,Kim Jiseong⁴

Affiliation:

1. Kwangwoon University,Department of Electronics and Communications Engineering,Seoul,South Korea

2. Nopion Co., Ltd.,Suwon,South Korea

3. Korea Radio Promotion Association,Seoul,South Korea

4. Korea Advanced Institute of Science and Technology (KAIST),Daejeon,South Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348835.pdf?arnumber=10348835

Reference9 articles.

1. 10+ gb/s 90-nm CMOS serial link demo in CBGA package

2. Universal Serial Bus Type-C cable and connector specification revision 1.3;Revision History,2017

3. HDMI Specification 1.4;HDMI Licensing, LLC,2017

4. On-chip PDN design effects on 3D stacked on-chip PDN impedance based on TSV interconnection

5. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

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