The Experiment Study of Thermocouple Power Sensor with Porous Ground Plane

Author:

Yu Yiran1,Zhang Ting1,Nian Fushun1,Han Shunli1,Xu Yanfeng2,Zhang Wenzheng1

Affiliation:

1. The 41st Institute of CETC,Qingdao,P.R. China,26555

2. Ceyear Technologies Co., Ltd,Qingdao,P.R. China,26555

Publisher

IEEE

Reference7 articles.

1. A thermocouple-based self-heating RF power sensor with GaAs MMIC-compatible micromachining technology;zhiqiang;IEEE Electron Device Letters,2012

2. Research on a Ka - Band MEMS Power Sensor Investigated with an MEMS Cantilever Beam;debo;Chinese Journal of Electronics,2020

3. DC-25 GHz and low-loss MEMS thermoelectric power sensors with floating thermal slug and reliable back cavity based on GaAs MMIC technology;zhiqiang;Micromachines,2018

4. An insertion thermoelectric RF MEMS power sensor for GaAs MMIC-compatible applications;zhiqiang;IEEE Microwave and Wireless Components Letters,2015

5. A novel thermoelectric and capacitive power sensor with improved dynamic range based on GaAs MMIC technology;bo;IEEE Electron Device Letters,2011

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