Metrological Characterization of Cold Plates for Power Converters
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/19/7348918/07302050.pdf?arnumber=7302050
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. FEM Thermo-Fluid Dynamic Analysis of Advanced Metal Finned Liquid Cold Plates for High Power Semiconductor Devices and Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
2. FEM Analysis of 3D Printable Finned Metal Liquid Cold Plates for Semiconductor Power Modules;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
3. FEM Simulation-Based Failure Analysis of Additive Manufacturing Liquid Cold Plates for More Reliable Power Press-Pack Assemblies;2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2021-09-15
4. CFD modeling of additive manufacturing liquid cold plates for more reliable power press-pack assemblies;Microelectronics Reliability;2020-11
5. Design and Control of High-Density High-Voltage Smart Converter for Food Ohmic Heating;IEEE Transactions on Industry Applications;2019-11
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