Modeling, Quantification, and Reduction of the Impact of Uncontrolled Return Currents of Vias Transiting Multilayered Packages and Boards
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration (IZM) Berlin, Berlin, Germany
2. School of Electrical Engineering and Computer Sciences, Technical University Berlin, Berlin, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx5/15/5466499/05467342.pdf?arnumber=5467342
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