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A Novel Pinned Cover Design With an Array of Three-Dimensional n-Pole Elements for Low-Frequency Filtering of Microwave Circuit Packages

  • Published:2018-12 Issue:6 Volume:60 Page:1819-1824
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Nisanci Muhammet HilmiORCID

Funder

TUBITAK-The Scientific and Technological Research Council of Turkey

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Signal Integrity Assessment of Interconnects Routed Within Bandgap Metallic Cavities;IEEE Transactions on Signal and Power Integrity;2022

2. Signal Integrity and Crosstalk Analysis of PCBs Within a PEC-PMC Bandgap Metallic Cavity;2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium;2021-07-26

3. Efficient Analytical Prediction of the Cavity Resonant Behavior of PEC–PMC Metallic Enclosures and Packages;IEEE Transactions on Electromagnetic Compatibility;2021-02

4. Multiband and Broadband Interference-Free Metallic Package Designs for Microwave Modules;IEEE Microwave and Wireless Components Letters;2020-11

5. Tunable Band-Gap for Metallic Packages and Cavities;2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE;2020-09-23
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