Multiphysics Tensorial Network Analysis Applied to PCB Interconnect Fatigue Under Thermal Cycle Aggression-Reference-Cited by-同舟云学术

Multiphysics Tensorial Network Analysis Applied to PCB Interconnect Fatigue Under Thermal Cycle Aggression

Published:2019 Issue: Volume: Page:1-8
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Xu Zhifei,Ravelo Blaise,Maurice Olivier

Funder

Normandy Region for the BRIDGE

Plateforme transversale de recherche entre les Bandes optiques et Radioelectriques: Integrite du signal et de la puissance Detection et detecteurs Generation Electromagnetique ultra-breve et intense

ERDF

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/15/4358749/08709817.pdf?arnumber=8709817

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