Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
9 articles.
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1. Circuit Model Construction for Simulating ESD Discharge Current Flowing through CMCs and ESD Suppression Devices;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Load-line Dependent Current Filament Dynamics in N anoscale SCR Devices;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
3. Improved SEED Modeling of an ESD Discharge to a USB Cable;IEEE Transactions on Electromagnetic Compatibility;2023-06
4. Study on ESD Protection Circuit by TCAD Simulation and TLP Experiment;Micromachines;2023-03-04
5. Comparison of ESD Damage Test for Common-Mode Chokes With ESD Gun and TLP-HMM;IEEE Letters on Electromagnetic Compatibility Practice and Applications;2023-03