On-Chip Cross-Layer Infrastructure to Leverage System Reliability for Aero-Space Applications: Embedded Tutorial
Author:
Affiliation:
1. IHP - Leibniz Institute for High Performance Microelectronics,Frankfurt Oder,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10508803/10508898/10508909.pdf?arnumber=10508909
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