Easy Plating—A Simple Approach to Suppress Parasitically Metallized Areas in Front Side Ni/Cu Plated Crystalline Si Solar Cells-Reference-Cited by-同舟云学术

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Easy Plating—A Simple Approach to Suppress Parasitically Metallized Areas in Front Side Ni/Cu Plated Crystalline Si Solar Cells

Published:2017-09 Issue:5 Volume:7 Page:1270-1277
ISSN:2156-3381
Container-title:IEEE Journal of Photovoltaics
language:
Short-container-title:IEEE J. Photovoltaics

Author:

Kluska Sven¹,Buchler Andreas¹,Bartsch Jonas¹,Grubel Benjamin¹,Brand Andreas A.¹,Gutscher Simon¹,Cimiotti Gisela¹,Nekarda Jan¹,Glatthaar Markus¹

Affiliation:

1. Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany

Funder

German Federal Ministry for Economic Affairs and Energy

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503869/8013037/07974759.pdf?arnumber=7974759

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Bath Composition, Current Density and Annealing Conditions on the Properties of the Electrodeposited Ni Seed Layer for Cu Contacts in Si Solar Cells;Journal of Electronic Materials;2024-06-07

2. Overcoming Throughput Limitations of Laser Systems in Solar Cell Manufacturing via On‐The‐Fly Processing Using Polygon Scanners;Energy Technology;2023-07-25

3. Atomic Force Microscopy Analysis of Aluminum Layer Properties and Correlation to Masking Functionality in Copper Plating Metallization for Solar Cells;Solar RRL;2023-07-25

4. Printing technologies for silicon solar cell metallization: A comprehensive review;Progress in Photovoltaics: Research and Applications;2023-02-28

5. Enabling savings in silver consumption and poly-Si thickness by integration of plated Ni/Cu/Ag contacts for bifacial TOPCon solar cells;Solar Energy Materials and Solar Cells;2022-10

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