Worldwide Lifetime Prediction of c-Si Modules Due to Finger Corrosion: A Phenomenological Approach
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, Purdue University College of Engineering, West Lafayette, IN, USA
Funder
National Science Foundation at Purdue University
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://ieeexplore.ieee.org/ielam/5503869/9863621/9842324-aam.pdf
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5. Electrical Signatures of Corrosion and Solder Bond Failure in c-Si Solar Cells and Modules
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