Material effects on the performance and reliability of high-power molded dual-in-line packages-Reference-Cited by-同舟云学术

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Material effects on the performance and reliability of high-power molded dual-in-line packages

Published: Issue: Volume: Page:
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Container-title:38th Electronics Components Conference 1988., Proceedings.
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Author:

DiOrio M.,Pinamaneni S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx2/751/544/00012624.pdf?arnumber=12624

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging Issues for SiGe Circuits;Circuits and Applications Using Silicon Heterostructure Devices;2007-12-13

2. Packaging Issues for SiGe Circuits;Silicon Heterostructure Handbook;2005-11

3. A Review of Package Stress Modelling;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999

4. Package Reliability;Microelectronics Packaging Handbook;1997

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