Author:
Koyanagi M.,Takata H.,Mori H.,Iba J.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
26 articles.
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1. Integrated Silicon Optoelectronics;Springer Series in Optical Sciences;2010
2. 3D technology based circuit and architecture design;2009 International Conference on Communications, Circuits and Systems;2009-07
3. High-Density Through Silicon Vias for 3-D LSIs;Proceedings of the IEEE;2009-01
4. Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections;IEEE Transactions on Electron Devices;2006-11
5. Interconnections, Optical;digital Encyclopedia of Applied Physics;2004-07-15