A multigrid method for solution of the diffusion equation in VLSI process modeling
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/16/31881/01483154.pdf?arnumber=1483154
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. AN EFFICIENT DIFFUSION ALGORITHM FOR 2‐D VLSI PROCESS MODELING CODE;COMPEL - The international journal for computation and mathematics in electrical and electronic engineering;1990-04
2. Efficient simulation of impurity redistribution in VLSI fabrication processes;Solid-State Electronics;1988-12
3. CAPCAL-a 3-D capacitance solver for support of CAD systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;1988-05
4. Numerical Conformal Mapping of a Towel-Shaped Region onto a Rectangle;SIAM Journal on Scientific and Statistical Computing;1985-10
5. A semi-two-dimensional numerical scheme for solving impurity profile in semiconductors;IEEE Transactions on Electron Devices;1985-09
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