AC Corona Degradation of Silicone Rubber Nanocomposites at Low Air Pressure
Author:
Affiliation:
1. School of Electrical Sciences, Indian Institute of Technology Goa, Farmagudi, Ponda, Goa, India
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/94/9808410/09760409.pdf?arnumber=9760409
Reference25 articles.
1. Corona degradation of the polymer insulator samples under different fog conditions
2. Performance of silicone rubber composites with SiO2 micro/nano-filler under AC corona discharge
3. Corona aging studies on silicone rubber nanocomposites
4. Comparison between silicone rubber containing micro- and nano-size silica fillers
5. Comparative study of SiR/EPDM containing nano-alumina and titanium dioxides in electrical surface tracking
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Quasi-Static AC Surface Charging of Polymeric Insulators At Low Pressure;IEEE Transactions on Industry Applications;2024-07
2. Closed loop recycling of electrically damaged meta-aramid papers with high electrical insulation and mechanical strength;Composites Science and Technology;2024-07
3. Aging Mechanisms and Evaluation Methods of Silicone Rubber Insulator Sheds: A Review;IEEE Transactions on Dielectrics and Electrical Insulation;2023
4. Low-Pressure Optical Detection, Location, and Quantification of Electrical Discharges in Aircraft Wiring Systems;Aerospace;2022-12-21
5. Understanding the Surface Condition of Silicone Rubber Nanocomposite Due to Corona Aging Using AFM Imaging and LIBS Spectroscopy;IEEE Transactions on Dielectrics and Electrical Insulation;2022-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3