Potential of Epoxy Nanocomposites for Packaging Materials of High Voltage Power Modules: A Validation Using Experiments and Simulation-Reference-Cited by-同舟云学术

Potential of Epoxy Nanocomposites for Packaging Materials of High Voltage Power Modules: A Validation Using Experiments and Simulation

Author:

Chen Xiangrong¹,Wang Qilong¹,Ren Na²,Dai Chao¹,Awais Muhammad¹,Paramane Ashish³

Affiliation:

1. Zhejiang Provincial Key Laboratory of Electrical Machine Systems, College of Electrical Engineering, Zhejiang University,Hangzhou,Zhejiang,China

2. Hangzhou Global Scientific and Technological Innovation Center, Zhejiang University,Hangzhou,Zhejiang,China

3. National Institute of Technology,Electrical Engineering Department,Silchar,Assam,India

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

Reference23 articles.

3. Stacked substrates for high voltage applications;hohlfeld;7th Int Conf on Integrated Power Electronics Systems (CIPS) 2012,0

5. Improvement of electrical and material properties of epoxy resin / aluminum nitride nanocomposites for packaging materials;dai;Polym Test,2019

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