Powering Electronic Implants by High Frequency Volume Conduction: In Human Validation-Reference-Cited by-同舟云学术

Powering Electronic Implants by High Frequency Volume Conduction: In Human Validation

Published:2023-02 Issue:2 Volume:70 Page:659-670
ISSN:0018-9294
Container-title:IEEE Transactions on Biomedical Engineering
language:
Short-container-title:IEEE Trans. Biomed. Eng.

Author:

Minguillon Jesus¹^ORCID,Tudela-Pi Marc¹^ORCID,Becerra-Fajardo Laura¹^ORCID,Perera-Bel Enric¹^ORCID,del-Ama Antonio J.²^ORCID,Gil-Agudo Angel³,Megia-Garcia Alvaro³,Garcia-Moreno Aracelys¹^ORCID,Ivorra Antoni⁴^ORCID

Affiliation:

1. Department of Information and Communications Technologies, Universitat Pompeu Fabra, Spain

2. Electronic Technology Area, Rey Juan Carlos University, Spain

3. Department of Biomechanics and Technical Aids, National Hospital for Paraplegics, Spain

4. Serra Húnter Fellow Programme and the Department of Information and Communications Technologies, Universitat Pompeu Fabra, Barcelona, Spain

Funder

Research and Innovation Programme

ICREA Academia Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Biomedical Engineering

Link

http://xplorestaging.ieee.org/ielx7/10/10021907/09864046.pdf?arnumber=9864046

Reference69 articles.

1. Modeling of Capacitive Resonant Wireless Power and Data Transfer to Deep Biomedical Implants

2. Capacitive coupling for power and data telemetry to implantable biomedical microsystems

3. A new technique for transmission of signals from implantable transducers

4. A Survey on Intrabody Communications for Body Area Network Applications

5. Body-Guided Galvanic Coupling Communication for Secure Biometric Data

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