Integration of 5G and OPC UA for Smart Manufacturing of the Future-Reference-Cited by-同舟云学术

Integration of 5G and OPC UA for Smart Manufacturing of the Future

Published:2023-01-17 Issue: Volume: Page:
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Container-title:2023 IEEE/SICE International Symposium on System Integration (SII)
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Author:

Zhang Xiongfeng¹,Lim Seonjo²,Lee Changdae³,Song Won Seok²,Kim Yu Chul²,Yu Mengmeng²,Hong Seung Ho¹,Yoo Nam Hyun⁴,Wei Min⁵

Affiliation:

1. Hanyang University,Department of Electronic Engineering,Ansan,Korea,15588

2. Nestfield Co., Ltd,Ansan,Korea,15588

3. Seoul National University of Science and Technology,Seoul,Korea,01811

4. School of Computer Science & Engineering, Kyungnam University,Changwon,Korea,51767

5. Chongqing University of Posts and Telecommunications,National Industrial IoT International Cooperation Base,Chongqing,China

Publisher

IEEE

Link

Reference31 articles.

4. Using Digital Twins to Integrate 5G into Production Networks;5G-ACIA origination,0

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1. On the Performance of OPC-UA over 5G NPN with Layer 2 Communication;2024 IEEE International Conference on Communications Workshops (ICC Workshops);2024-06-09

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