Simulation and experiment of microstrip lines temperature rise based on COMSOL Multiphysics-Reference-Cited by-同舟云学术

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Simulation and experiment of microstrip lines temperature rise based on COMSOL Multiphysics

Published:2023-10-20 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
language:
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Author:

Huang Lijuan¹,Liao Jinfu²,Fang Wenxiao³,Wang Jianying¹

Affiliation:

1. School of Electronic and Information Engineering, South China Normal University,Foshan,China

2. Science and Technology on Reliability Physics and Application of Electronic,Component Laboratory,Guangzhou,China

3. School of integrated circuit, Sun Yat-Sen university,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10370006/10368602/10370330.pdf?arnumber=10370330

Reference7 articles.

1. Microwave Engineering

2. Field Theory of Guided Waves

3. Average power-handling capability of microstrip lines

4. A closed form solution of junction to substrate thermal resistance in semiconductor chips

5. Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity

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