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V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology

  • Published:2015-07 Issue:7 Volume:25 Page:436-438
  • ISSN:1531-1309
  • Container-title:IEEE Microwave and Wireless Components Letters
  • language:
  • Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Chahadih A.,Cresson Pierre Yves,Mismer C.,Lasri Tuami

Funder

French gouvernment program Investissements dAvenir managed by the National Research Agency ANR

Nord-Pas-de-Calais Regional Council and FEDER through the CPER-CIA project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Broadband, Via-less Grounded Coplanar Waveguide-to-Microstrip Transition in D-band;2023 53rd European Microwave Conference (EuMC);2023-09-19

2. A Horizontal Gradual Ultra-Low-Reflection Stripline to Grounded Coplanar Waveguide Transition;2022 IEEE MTT-S International Wireless Symposium (IWS);2022-08-12

3. InP-Based THz Beam Steering Leaky-Wave Antenna;IEEE Transactions on Terahertz Science and Technology;2021-03

4. Aerosol-Printed Highly Conductive Ag Transmission Lines for Flexible Electronic Devices;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-10

5. Radiative Quality Factor in Thin Resonant Metamaterial Absorbers;IEEE Transactions on Microwave Theory and Techniques;2018-04
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