30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via-Reference-Cited by-同舟云学术

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Published:2014-11 Issue:11 Volume:24 Page:814-816
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Jung Daniel H.,Kim Heegon,Kim Sukjin,Kim Jonghoon J.,Bae Bumhee,Kim Jonghoon,Yook Jong-Min,Kim Jun-Chul,Kim Joungho

Funder

R&D Convergence Program of Ministry of Science, ICT and Future Planning (MSIP) and Korea Research Council for Industrial Science and Technology (ISTK) of Korea under Grant

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx7/7260/6945917/06884870.pdf?arnumber=6884870

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