LTCC technology: where we are and where we're going. II-Reference-Cited by-同舟云学术

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LTCC technology: where we are and where we're going. II

Published:1999 Issue: Volume: Page:
ISSN:
Container-title:1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390)
language:
Short-container-title:

Author:

Scrantom C.Q.,Lawson J.C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/6089/16309/00755161.pdf?arnumber=755161

Cited by 60 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Study of Ag through via Interconnects for Integrated Horn Antennas in LTCC Substrates;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Hybridization of additive manufacturing processes to build ceramic/metal parts: Example of LTCC;Journal of the European Ceramic Society;2020-03

3. Concurrent sinter-crystallization and microwave dielectric characterization of CaO-MgO-TiO2-SiO2 glass-ceramics;Journal of Asian Ceramic Societies;2020-02-12

4. High quality factor microwave dielectric diopside glass-ceramics for the low temperature co-fired ceramic (LTCC) applications;Journal of Non-Crystalline Solids;2018-05

5. Assessment of LTCC-Based Dielectric Flat Lens Antennas and Switched-Beam Arrays for Future 5G Millimeter-Wave Communication Systems;IEEE Transactions on Antennas and Propagation;2017-12

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