Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module-Reference-Cited by-同舟云学术

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Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module

Published:2016-10 Issue: Volume: Page:
ISSN:
Container-title:2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Kuo Chih-Wen,Kuo Hung-Chun,Chu Fu-Chen,Wang Chen-Chao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7787253/7799968/07800063.pdf?arnumber=7800063

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of Ultra-thin Conformal EMI Shielding Coatings on SiP Modules by Inkjet Printing Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Effective low‐frequency EMI conformal shielding for system‐in‐package (SiP) modules;Microwave and Optical Technology Letters;2023-02-27

3. Near-Field Shielding Analysis of Conformal Coating Materials for Integrated Circuits;IEEE Transactions on Electromagnetic Compatibility;2022-10

4. Near-Field Scanning Based Shielding Effectiveness Analysis of System in Package;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-08

5. Radiation Emission Source Localization by Magnetic Near-Field Mapping Along the Surface of a Large-Scale IC With BGA Package;IEEE Transactions on Electromagnetic Compatibility;2021

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