Reliability of molded interconnect devices (MID) protected by encapsulation methods overmolding, potting and coating
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6409557/6420212/06420229.pdf?arnumber=6420229
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding;Journal of Polymer Engineering;2022-12-07
2. In-situ leakage behavior of polymer-metal hybrids under mechanical load;International Polymer Processing;2022-09-30
3. Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding;Polymer Engineering & Science;2021-02-19
4. Media-Tight Polymer-Polymer Assemblies By Means of Sintered Powder Layer in Assembly Injection Moulding;Procedia Manufacturing;2020
5. Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials;Journal of Electronic Packaging;2014-09-19
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