Author:
Deng Shang-Shiuan,Hwang Sheng-Jye,Lee Huei-Huang
Cited by
3 articles.
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1. Digital Twin in Manufacturing: Reflow Soldering Process;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. A Deep Learning Approach for Reflow Profile Prediction;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model;Soldering & Surface Mount Technology;2022-02-01