Suppression of Surface Roughening of Ag Films by Capping Layer for Ag/Ag Surface Activated Bonding
Author:
Affiliation:
1. Graduate School of Engineering, Tohoku University,Sendai,Japan
2. Frontier Research Institute for Interdisciplinary Sciences, Tohoku University,Sendai,Japan
Funder
JSPS KAKENHI
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10339391/10339529/10339608.pdf?arnumber=10339608
Reference6 articles.
1. Silver diffusion bonding and layer transfer of lithium niobate to silicon
2. Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization
3. Low temperature Ag-Ag direct bonding under air atmosphere
4. Low Temperature Metal-to-Metal Direct Bonding in Atmosphere using highly (111) Oriented Nanotwinned Silver Interconnects
5. Atomic diffusion bonding in air using Ag films
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1. Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
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