A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology-Reference-Cited by-同舟云学术

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A 0.5µm Pixel 3-layer Stacked CMOS Image Sensor with Deep Contact and In-pixel Cu-Cu Bonding Technology

Published:2023-12-09 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 International Electron Devices Meeting (IEDM)
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Author:

Lee Gwi-Deok Ryan¹,Kim Dae-Hoon¹,Kwon Doowon¹,Park Jong-Eun¹,Cho Dongseok¹,Kang Jeongsoon¹,Park Gyunha¹,Kang Junha¹,Jang Minho¹,Oh Seungjae¹,Kim Doyeon¹,Yoon Sol¹,Kim Yongjun¹,Park Sejin¹,Lim Kyungtae¹,Oh Dongjun¹,Kang SooYoung¹,Park Keunhyoung¹,Kim Changhwa¹,Kim Hyoju¹,Kim Taeyeong¹,Lee Kyu-Ha¹,Cho Hyoukyung¹,Hwang Son-Kwan¹,Lee Hojin¹,Lee Jae-Kyu¹,Kim Hyunchul¹,Moon Chang-Rok¹,Song Jaihyuk¹

Affiliation:

1. Samsung Electronics,Hwaseong-si,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10413659/10413660/10413687.pdf?arnumber=10413687

Reference4 articles.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wafer-On-Wafer-On-Wafer (WoWoW) Integration Having Large-scale High Reliability Fine 1 μm Pitch Face-To-Back (F2B) Cu-Cu Connections and Fine 6 μm Pitch TSVs;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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