N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+Memory Ultra-Dense 3D, 3D Thermal Scaffolding
Author:
Srimani T.1,
Bechdolt A.1,
Choi S.1,
Gilardi C.1,
Kasperovich A.1,
Li S.1,
Lin Q.1,
Malakoutian M.1,
McEwen P.1,
Radway R.M.1,
Rich D.1,
Yu A.C.2,
Fuller S.3,
Achour S.1,
Chowdhury S.1,
Wong H.-S. P.1,
Shulaker M.2,
Mitra S.1
Affiliation:
1. Stanford University
2. MTT
3. Analog Devices