Modeling and optimization of high power inverter three-layer laminated busbar

Author:

Chen Cai,Pei Xuejun,Shi Yunhao,Lin Xinchun,Liu Xinming,Kang Yong

Publisher

IEEE

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Optimal Busbar Design for the Press-Packed IGBT-Based Modular Multilevel Converter Submodule Considering Both Normal and Fault Ride-Through Conditions;IEEE Canadian Journal of Electrical and Computer Engineering;2024

2. DC Link Capacitors Selection and Arrangement Procedure in High Power Inverters: A General Review;2023 2nd International Engineering Conference on Electrical, Energy, and Artificial Intelligence (EICEEAI);2023-12-27

3. Busbars Structural Requirements for DC Link in High Power Inverters: A Systematic Review;2023 2nd International Engineering Conference on Electrical, Energy, and Artificial Intelligence (EICEEAI);2023-12-27

4. A Vertically Stacked Bus-bar Design Approach for Equal Power Loop Inductance in Three- Phase Voltage Source Inverter;2023 IEEE Transportation Electrification Conference & Expo (ITEC);2023-06-21

5. Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block With Enhanced Dynamic Current Sharing;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03

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