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TCPSbed: A Modular Testbed for Tactile Internet-Based Cyber-Physical Systems

  • Published:2021 Issue: Volume: Page:1-16
  • ISSN:1063-6692
  • Container-title:IEEE/ACM Transactions on Networking
  • language:
  • Short-container-title:IEEE/ACM Trans. Networking

Author:

Polachan KurianORCID,Pal Joydeep,Singh ChandramaniORCID,Prabhakar T. V.ORCID,Kuipers Fernando A.ORCID

Funder

Visvesvaraya Ph.D. Scheme

Visvesvaraya Young Faculty Research Fellowship

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Computer Science Applications,Software

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. MDTW Metric: A Signal Matching Yardstick for Accurately Evaluating the Quality of Tactile Internet;IEEE Transactions on Network Science and Engineering;2024-07

2. Towards a TSN-DetNet Intercity Testbed for Tactile Cyber-Physical Systems;IEEE INFOCOM 2024 - IEEE Conference on Computer Communications Workshops (INFOCOM WKSHPS);2024-05-20

3. Hirail: Core-Agnostic Deterministic Networks for Long-Distance Time-Sensitive IIoT Applications;IEEE Internet of Things Journal;2024-05-15

4. Emulation Framework for Haptic Data Transmission Using Real-Time Transport Protocol;International Journal of Online and Biomedical Engineering (iJOE);2023-06-13

5. Assessing Quality of Control in Tactile Cyber–Physical Systems;IEEE Transactions on Network and Service Management;2022-12
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