Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/8336027/8340970/08341179.pdf?arnumber=8341179
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Cooling Method and Investigation on Process of Interconnection for High-temperature SiC Applications;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29
2. The Proposed Automated Optimal Design for Power Switch: A Thermo-mechanical-Coordinated and Multi-objective-Oriented Optimization Methodology;Automated Design of Electrical Converters with Advanced AI Algorithms;2023
3. 1.2 kV SiC MOSFET Full-Bridge Power Module with Integrated Gate Driver and Coupled Inductor;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09
4. Hierarchical Layout Synthesis and Optimization Framework for High-Density Power Module Design Automation;2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD);2021-11-01
5. PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules;IEEE Transactions on Power Electronics;2021-08
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