Progress in the methodologies for the electrical modeling of interconnects and electronic packages-Reference-Cited by-同舟云学术

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Progress in the methodologies for the electrical modeling of interconnects and electronic packages

Published:2001-05 Issue:5 Volume:89 Page:740-771
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Ruehli A.E.,Cangellaris A.C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5/20097/00929652.pdf?arnumber=929652

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