Investigation on Heat Dissipation Performance of a Multi-channel Digital Array Module
Author:
Affiliation:
1. The 38th Research Institute of China Electronics Technology Group, Corporation,Hefei,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9935818/9936057/09936573.pdf?arnumber=9936573
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5. Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources
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