Level 4 Autonomous Driving SoC, leveraging chiplet, advanced package and UCIe-Reference-Cited by-同舟云学术

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Level 4 Autonomous Driving SoC, leveraging chiplet, advanced package and UCIe

Published:2023-08 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Symposium on High-Performance Interconnects (HOTI)
language:
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Author:

Agrawal Vinayak¹,Piednoel Francois²,Elkanovich Igor³,Sil Dwaipayan⁴,Jahan Mirza⁵

Affiliation:

1. Intel Corporation,Intel Foundry Services,Bangalore,India

2. Mercedez Benz,North America Research,Santa Clara,USA

3. Global Unichip,CTO,Jerusalem,Israel

4. Intel Corporation,Advanced Technology Development,Phoenix,USA

5. Intel Corporation,Intel Foundry Servies,Phoenix,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10287280/10287119/10287296.pdf?arnumber=10287296

Reference14 articles.

1. The use and evaluation of yield models in integrated circuit manufacturing

2. Cramming more components onto integrated circuits;moore;Electronics,1965

3. High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem;das sharma;Plenary talk at IEEE Heterogeneous Integration Roadmap (HIR) Workshop,2023

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06

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