Author:
Li Jun,Han Ming-chuan,Liu Mei,Wang Han-Sheng,Wang Zhi-Jie
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Challenges & Solutions of Cu Wire Bonding on DFN Package with Low Modulus LeadFrame Tape;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10