Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs-Reference-Cited by-同舟云学术

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Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs

Published:2021-10 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International 3D Systems Integration Conference (3DIC)
language:
Short-container-title:

Author:

Rajan Sreejith Kochupurackal¹,Kaul Ankit¹,May Gary S.¹,Bakir Muhannad S.¹

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology,Atlanta,GA,30332

Funder

NSF

DARPA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9687597/9687598/09687618.pdf?arnumber=9687618

Reference18 articles.

1. Thermal and hydrodynamic analysis of microchannel heat sinks: A review

2. Experimental study on liquid flow and heat transfer in micro square pin fin heat sink

3. Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds

4. “Zeppelin”: An SoC for Multichip Architectures

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