Packaging Multiple Active and Passive Elements in a Hybrid Optical Platform-Reference-Cited by-同舟云学术

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Packaging Multiple Active and Passive Elements in a Hybrid Optical Platform

Published:2004-05 Issue:5 Volume:22 Page:1320-1326
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:en
Short-container-title:J. Lightwave Technol.

Author:

Schleuning D.A.,Dato R.,Frangineas G.,Jansen M.,King C.,Nabiev R.,Nabors C.D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx5/50/28855/01298858.pdf?arnumber=1298858

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced Packaging of Optoelectronic Devices;Wiley Encyclopedia of Electrical and Electronics Engineering;2013-01-18

2. Hermetic Fiber Pigtailed Laser Module Utilizing Passive Device Alignment on an LTCC Substrate;IEEE Transactions on Advanced Packaging;2009-02

3. The art of optoelectronic packaging;2008 10th Anniversary International Conference on Transparent Optical Networks;2008-06

4. Injection moulding integration of a red VCSEL illuminator module for a hologram reader sensor;Optical Sensing Technology and Applications;2007-05-04

5. Thermomechanically Driven Polymer Actuator for High-Precision Optical Alignment;IEEE Photonics Technology Letters;2007-02

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