Author:
Motoyoshi Makoto,Yanagimura Kohki,Fushimi Taikoh,Takanohashi Junichi,Murugesan Mariappan,Aoyagi Masahiro,Koyanagi Mitsumasa
Cited by
2 articles.
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1. Au bump connection technology for 3D stacked sensors and detectors;2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD);2023-11-04
2. 3D Stacked Pixel Detector and Sensor Technology Using Robust Micro-Bump Junction;Journal of The Japan Institute of Electronics Packaging;2020-01-01