DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy
Author:
Affiliation:
1. EDA Center, Institute of Microelectronics Chinese Academy of Sciences, Beijing, China
Funder
Network Security and Information Special Project, Chinese Academy of Sciences
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx8/66/10636181/10571599.pdf?arnumber=10571599
Reference21 articles.
1. A closed-form analytic model for ILD thickness variation in CMP processes;Stine
2. Integrated chip-scale simulation of pattern dependencies in copper electroplating and copper chemical mechanical polishing processes
3. Physical understanding and modeling of chemical mechanical planarization in dielectric materials;Xie,2007
4. Greenwood–Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP
5. Modeling of Cu-CMP and Its Application for Hotspot Prediction
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