Progressive Degradation Without Physical Failure During Mounting Due to Soft Overstress in Compound HBT for RF, Mobile, and Automotive Applications
Author:
Affiliation:
1. QRT Inc,Gyeonggi-do,Republic of Korea,16229
2. Ewha Womans University,Seoul,Republic of Korea,03760
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9764406/9764408/09764410.pdf?arnumber=9764410
Reference8 articles.
1. Safe Operating Area of GaAs HBTs Based on Sub-Nanosecond Pulse Characteristics
2. InGaP/GaAs HBT safe operating area and thermal size effect;tao;Proc CS MANTECH Conf,2013
3. Studies of Safe Operating Area of InGaP/GaAs Heterojunction Bipolar Transistors
4. Study on mechanisms of InGaP/GaAs HBT safe operating area using TCAD simulation
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