Solder Joints Accelerated Degradation Model and Life Prediction Method Based on Gamma Process
Author:
Affiliation:
1. University of Science and Technology of China,State Key Laboratory of Fire Science,Hefei,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10379852/10379855/10380065.pdf?arnumber=10380065
Reference21 articles.
1. Corrosion behavior of Sn-based lead-free solder alloys: a review
2. Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
3. Corrosion behavior of Sn-3.0Ag-0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene
4. Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders
5. Effect of relative humidity on corrosion behavior of SAC305 and Sn–37Pb solders under polyvinyl chloride fire smoke atmosphere
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