1. CASE STUDIES – DEVICE ANALYSIS: Accelerate Your 3D X-Ray Failure Analysis by Deep Learning High Resolution Reconstruction;gu;Int Symp Testing and Failure Analysis (ISTFA),2021
2. Advanced Reconstruction Technologies for Semiconductor Advanced Packaging;andrew;Technical Note,0
3. A new approach for rapid analysis of buried 2.5/3D package structures;hartfield;Chip Scale Review,2020
4. Novel Workflow for High-Resolution Imaging of Structures in Advanced 3D and Fan-Out Packages
5. Addressing Failures in Advanced Packaging Through a Correlative Workflow