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Dual Polarized FOWLP AiP for 5G Base Station Applications

  • Published:2021-12-07 Issue: Volume: Page:
  • ISSN:
  • Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Mei Sun,Guan Lim Teck

Publisher

IEEE

Reference7 articles.

1. FOWLP RF Passive Circuit Designs for 77GHz MIMO radar applications;sun;2020 IEEE 21st Electronics Packaging Technology Conference (EPTC),2020

2. Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application

3. Semiconductor package and method of forming the same;chang;US20200185299A1,0

4. FOWLP AiP Optimization for Automotive Radar Applications;sun;2021 IEEE electronic component and technology conference (ECTC),2021

5. A 28-GHz CMOS Direct Conversion Transceiver With Packaged $2 \times 4$ Antenna Array for 5G Cellular System

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-wideband Antenna in Package with Dual Polarizations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

3. Characterization of FOWLP Antenna in Packages;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

4. Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Performance Investigation of Solar Photovoltaic System for Mobile Communication Tower Power Feeding Application;International Journal of Electrical and Electronics Research;2022-12-30
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