Author:
Ke Chung-Yu,Chen Liang-Pin
Reference5 articles.
1. Detection of micro defects in 3dic packages by means of non-destructive 3D X-ray;lee;2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT),2012
2. X-ray computed tomography for non-destructive failure analysis in microelectronics
3. Applications of 3D X-Ray Microscopy for Advanced Package Development
4. A review of 3-D packaging technology
5. InFO (wafer level integrated fan-out) technology;tseng;2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ECTC,2016
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