A Model Assisted Testing Scheme for Modular Multilevel Converter

Author:

Tang Yuan,Ran Li,Alatise Olayiwola,Mawby Philip

Funder

U.K. Engineering and Physical Science Research Council (EPSRC)

Underpinning Power Electronics Components Theme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Digital Twin-Based Model Construction and Parameter Identification Method for MMC Half-Bridge Submodule;IEEE Sensors Journal;2024-08-01

2. Transient current distribution among elements in metallized film capacitor for converter valves;Journal of Physics D: Applied Physics;2023-12-14

3. Dynamic Mission Profile Emulation for short-term reliability test of Submodule in Modular Multilevel Converter;2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04

4. A Submodule Test Method for Modular Multilevel Converter Based on Hardware-in-the-Loop System;2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG);2023-06-09

5. Analysis of Operational Characteristics and Equivalent Test Method for IGBTs in MMC;CSEE Journal of Power and Energy Systems;2023

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