Application of copper-Carbon Nanotubes composite in packaging interconnects
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6036129/6053535/06053943.pdf?arnumber=6053943
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research progress, potentials, and challenges of copper composite for metal injection moulding feedstock;Powder Technology;2024-05
2. An Introduction to Nanomaterials for Nanopackaging;IEEE Nanotechnology Magazine;2024-04
3. High Speed Interconnects Made of Composite Materials for VLSI Application;Lecture Notes in Electrical Engineering;2022
4. Carbon Nanotube Technology as an Option for Future Computing Devices;Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering;2018
5. Mitigating Electromigration in Physical Design;Fundamentals of Electromigration-Aware Integrated Circuit Design;2018
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