Miniaturization and advanced functionalities of SAW devices-Reference-Cited by-同舟云学术

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Miniaturization and advanced functionalities of SAW devices

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Container-title:2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)
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Author:

Meier H.,Baier T.,Riha G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7345/19934/00922581.pdf?arnumber=922581

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. SAW Cavity Sealing using Dielectric film in Wafer-level packaging;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

2. Copper Pillar Bumps on Acoustic Wave Components;2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC);2019-09

3. Surface acoustic wave filters: Possibilities of miniaturization and functional integration;Journal of Communications Technology and Electronics;2009-12

4. SAW front-end module for GSM-based dual-band cellular phones with direct-conversion demodulation;IEEE Transactions on Microwave Theory and Techniques;2002-11

5. Balanced front-end hybrid SAW modules with impedance conversion;2002 IEEE Ultrasonics Symposium, 2002. Proceedings.

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